Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/28/2019
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Application #:
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15396208
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Filing Dt:
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12/30/2016
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Publication #:
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Pub Dt:
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05/03/2018
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Inventors:
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An-Jhih Su, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Chen-Hua Yu
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Title:
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REDISTRIBUTION LAYERS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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