Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/16/2020
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Application #:
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15574638
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Filing Dt:
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11/16/2017
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Publication #:
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Pub Dt:
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05/10/2018
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Inventors:
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Daigo HIRAKAWA, Masanori TAKANASHI
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Title:
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THERMALLY CONDUCTIVE COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-2-20, AKASAKA |
| MINATO-KU, TOKYO, JAPAN 107-6119 |
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| FLYNN, THIEL, BOUTELL & TANIS, P.C. |
| 2026 RAMBLING ROAD |
| KALAMAZOO, MI 49008 |
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