Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/15/2018
|
Application #:
|
15478419
|
Filing Dt:
|
04/04/2017
|
|
Publication #:
|
|
Pub Dt:
|
05/17/2018
| | | | |
|
Inventor:
|
Kenichi KAWABATA
|
|
Title:
|
COMPOSITE MAGNETIC SEALING MATERIAL AND ELECTRONIC CIRCUIT PACKAGE USING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 13-9-1, SHIBAURA |
| MINATO-KU |
| TOKYO, JAPAN 108-0023 |
|
|
|
|
| YOUNG LAW FIRM, P.C. |
| 4370 ALPINE ROAD |
| SUITE 202 |
| PORTOLA VALLEY, CA 94028 |
|
|
Search Results as of:
05/03/2024 11:30 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
