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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/04/2021
Application #:
15816699
Filing Dt:
11/17/2017
Publication #:
Pub Dt:
05/24/2018
Inventors:
Jin-Woo Lee, Hoon Han, Jin-Uk Lee, Keon-Young Kim, Jae-Wan Park, Jung-Hun Lim
Title:
ETCHANT COMPOSITION AND METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
044169/0737Recorded: 11/19/2017Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/08/2017
Exec Dt:
08/08/2017
Exec Dt:
08/03/2017
Exec Dt:
08/14/2017
Exec Dt:
08/14/2017
Exec Dt:
08/14/2017
Assignees:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
34, PANGYO-RO 225BEON-GIL
BUNDANG-GU, SEONGNAM-SI
GYEONGGI-DO, KOREA, REPUBLIC OF 13486
Correspondent:
VOLENTINE & WHITT, PLLC
11951 FREEDOM DRIVE, SUITE 1300
RESTON, VA 20190

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