Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/03/2019
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Application #:
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15815460
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Filing Dt:
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11/16/2017
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Publication #:
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Pub Dt:
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05/24/2018
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Inventors:
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Zhiqi Wang, Yuanfei Liu, Hongjun Liu
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Title:
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FINGERPRINT SENSING CHIP PACKAGING METHOD AND FINGERPRINT SENSING CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 29 TINGLAN LANE SIP |
SUZHOU, JIANGSU, CHINA 215026 |
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WOLF GREENFIELD & SACKS, P.C. |
600 ATLANTIC AVENUE |
BOSTON, MA 02210 |
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05/22/2024 10:47 AM
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