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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
15863269
Filing Dt:
01/05/2018
Publication #:
Pub Dt:
05/24/2018
Inventors:
Masashi Nakagawa, Takehiro Seike, Hideki Watanabe, Yoshihisa Shibuya, Shunji Kuwana
Title:
HIGH-FREQUENCY MODULE
Assignment: 1
Reel/Frame:
044546/0692Recorded: 01/05/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/13/2017
Exec Dt:
12/13/2017
Exec Dt:
12/13/2017
Exec Dt:
12/13/2017
Exec Dt:
12/13/2017
Assignee:
1-7, YUKIGAYA-OTSUKAMACHI,
OTA-KU,
TOKYO, JAPAN 145-8501
Correspondent:
GUSTAVO SILLER, JR. BY MARIA CAMACHO
BRINKS GILSON & LIONE
PO BOX 10395
CHICAGO, IL 60610
Assignment: 2
Reel/Frame:
048220/0317Recorded: 02/01/2019Pages: 8
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/30/2019
Assignee:
1-7, YUKIGAYA-OTSUKAMACHI, OTA-KU
TOKYO, JAPAN 145-8501
Correspondent:
GUSTAVO SILLER, JR. BY MARIA CAMACHO
BRINKS GILSON & LIONE
PO BOX 10395
CHICAGO, IL 60610

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