Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/18/2018
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Application #:
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15613963
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Filing Dt:
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06/05/2017
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Publication #:
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Pub Dt:
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05/31/2018
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Inventors:
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Chang-Chen Tsao, Kuo Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng et al
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Title:
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WAFER DEBONDING SYSTEM AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
HSIN-CHU SCIENCE PARK |
HSIN-CHU, TAIWAN 300-77 |
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ESCHWEILER & POTASHNIK, LLC |
ROSETTA CENTER |
629 EUCLID AVE., SUITE 1000 |
CLEVELAND, OH 44114 |
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