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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10377948
Issue Dt:
08/13/2019
Application #:
15809597
Filing Dt:
11/10/2017
Publication #:
20180148645
Pub Dt:
05/31/2018
Inventors:
Hyo Sun LEE, Ho Young KIM, Sang Won BAE, Min Goo KIM, Jung Hun LIM, Yong Jae CHOI
Title:
ETCHING COMPOSITION AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE BY USING THE SAME
Assignment: 1
Reel/Frame:
044101/0271Recorded: 11/13/2017Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KIM, MIN GOO
Exec Dt:
05/16/2017
LIM, JUNG HUN
Exec Dt:
05/15/2017
CHOI, YONG JAE
Exec Dt:
06/01/2017
Assignee:
SOULBRAIN CO., LTD
34 PANGYO-RO, 255BEON-GIL
BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195
Assignment: 2
Reel/Frame:
044101/0255Recorded: 11/13/2017Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEE, HYO SUN
Exec Dt:
10/19/2017
KIM, HO YOUNG
Exec Dt:
10/20/2017
BAE, SANG WON
Exec Dt:
10/19/2017
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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