Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/20/2019
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Application #:
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15830644
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Filing Dt:
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12/04/2017
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Publication #:
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Pub Dt:
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06/07/2018
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Inventors:
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OhHan Kim, DeokKyung Yang, HunTeak Lee, InSang Yoon, Il Kwon Shim
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Title:
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Semiconductor Device and Method of Forming a 3D Interposer System-In-Package Module
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| TECHPOINT #04-08/09 |
| SINGAPORE, SINGAPORE 569059 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 55 N. ARIZONA PLACE |
| SUITE 104 |
| CHANDLER, AZ 85225 |
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