Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/26/2019
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Application #:
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15366219
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Filing Dt:
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12/01/2016
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Publication #:
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Pub Dt:
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06/07/2018
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Inventor:
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KENICHI KAWABATA
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Title:
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ELECTRONIC CIRCUIT PACKAGE HAVING HIGH COMPOSITE SHIELDING EFFECT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-9-1, SHIBAURA |
| MINATO-KU |
| TOKYO, JAPAN 108-0023 |
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| YOUNG LAW FIRM, PC |
| 4370 ALPINE ROAD |
| SUITE 202 |
| PORTOLA VALLEY, CA 94028 |
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