Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/27/2020
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Application #:
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15827056
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Filing Dt:
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11/30/2017
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Publication #:
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Pub Dt:
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06/07/2018
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Inventors:
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Hideta Arai, Ryo Fukuchi, Atsushi Miki
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Title:
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Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-2, OTEMACHI 1-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 1008164 |
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MARSHALL, GERSTEIN & BORUN LLP |
233 SOUTH WACKER |
SUITE 6300 |
CHICAGO, IL 60606 |
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Assignment:
2
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10-4, TORANOMON 2-CHOME, MINATO-KU |
TOKYO, JAPAN 100-8164 |
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CPA GLOBAL LIMITED |
LIBERATION HOUSE |
CASTLE ST |
ST HELIER, JE1 1BL JERSEY |
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