Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/16/2021
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Application #:
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15738927
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Filing Dt:
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12/21/2017
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Publication #:
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Pub Dt:
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06/21/2018
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Inventors:
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Yong Zheng, Brian W. Walther, Santosh S. Bawiskar, Cristina Serrat
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Title:
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RESINS FOR USE AS TIE LAYER IN MULTILAYER STRUCTURE AND MULTILAYER STRUCTURES COMPRISING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2040 DOW CENTER |
MIDLAND, MICHIGAN 48674 |
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DANNY CHILDS |
2211 H.H. DOW WAY |
SSC-1338 |
MIDLAND, MI 48674 |
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