Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/03/2020
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Application #:
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15382805
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Filing Dt:
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12/19/2016
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Publication #:
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Pub Dt:
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06/21/2018
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Inventors:
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Haibo Fan, Pompeo v. Umali, Tim Boettcher, Wai Wong Chow
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Title:
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SEMICONDUCTOR DEVICE AND METHOD WITH CLIP ARRANGEMENT IN IC PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HIGH TECH CAMPUS 60 |
| EINDHOVEN, NETHERLANDS 5656 AG |
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| INTELLECTUAL PROPERTY AND LICENSING NXP |
| 411 EAST PLUMERIA DRIVE, MS41 |
| SAN JOSE, CA 95134 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HIGH TECH CAMPUS 60 |
| EINDHOVEN, NETHERLANDS 5656 AG |
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| INTELLECTUAL PROPERTY AND LICENSING NXP |
| 411 EAST PLUMERIA DRIVE, MS41 |
| SAN JOSE, CA 95134 |
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Assignment:
3
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| JONKERBOSPLEIN 52 |
| NIJMEGEN, NETHERLANDS 6534 AB |
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| OHLANDT GREELEY RUGGIERO & PERLE LLP |
| ONE LANDMARK SQUARE, 10TH FLOOR |
| STAMFORD, CT 06901 |
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