Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/21/2018
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Application #:
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15895575
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Filing Dt:
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02/13/2018
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Publication #:
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Pub Dt:
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06/21/2018
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Inventors:
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Ying-Nan WEN, Wei-Chung YANG, Ho-Yin YIU, Chien-Hung LIU
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Title:
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CHIP PACKAGE HAVING CHIP CONNECTED TO SENSING DEVICE WITH REDISTRIBUTION LAYER IN INSULATOR LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
| JHONGLI DIST. |
| TAOYUAN CITY, TAIWAN 32062 |
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| WEN LIU |
| 350 S. FIGUEROA STREET, SUITE 975 |
| LOS ANGELES, CA 90071 |
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