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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10517179
Issue Dt:
12/24/2019
Application #:
15621646
Filing Dt:
06/13/2017
Publication #:
20180177055
Pub Dt:
06/21/2018
Inventors:
Siao-Shan Wang, Cheng-Han WU, Ching-Yu CHANG, Chin-Hsiang LIN
Title:
Material Composition and Methods Thereof
Assignment: 1
Reel/Frame:
042696/0334Recorded: 06/13/2017Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, SIAO-SHAN
Exec Dt:
05/19/2017
WU, CHENG-HAN
Exec Dt:
05/19/2017
CHANG, CHING-YU
Exec Dt:
05/19/2017
LIN, CHIN-HSIANG
Exec Dt:
05/19/2017
Assignee:
TAIWIN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, , LI-HSIN, RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219
Assignment: 2
Reel/Frame:
043634/0275Recorded: 08/22/2017Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 4TH ASSIGNOR EXECUTION DATE AND ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 042696 FRAME: 0334. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
WANG, SIAO-SHAN
Exec Dt:
05/19/2017
WU, CHENG-HAN
Exec Dt:
05/19/2017
CHANG, CHING-YU
Exec Dt:
05/19/2017
LIN, CHIN-HSIANG
Exec Dt:
05/26/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN, RD. 6 HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP
2323 VICTORY, SUITE 700
DALLAS, TX 75219

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