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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10483239
Issue Dt:
11/19/2019
Application #:
15907600
Filing Dt:
02/28/2018
Publication #:
20180190621
Pub Dt:
07/05/2018
Inventors:
Junrong Yan, Xiaofeng Di, Harjashan Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu et al
Title:
SEMICONDUCTOR DEVICE INCLUDING DUAL PAD WIRE BOND INTERCONNECTION
Assignment: 1
Reel/Frame:
045062/0391Recorded: 02/28/2018Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YAN, JUNRONG
Exec Dt:
02/26/2018
DI, XIAOFENG
Exec Dt:
02/26/2018
SINGH, HARJASHAN
Exec Dt:
02/27/2018
KUMAR, GOKUL
Exec Dt:
02/21/2018
CHIN, CHEE KEONG
Exec Dt:
02/26/2018
WU, MING XIA
Exec Dt:
02/26/2018
GU, JIAN BIN
Exec Dt:
02/26/2018
Assignee:
SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
NO. 388, JIANG CHUAN EAST ROAD
MINHANG DISTRICT
SHANGHAI, CHINA 200241
Correspondent:
VIERRA MAGEN MARCUS LLP
101 MISSION STREET, SUITE 400
SAN FRANCISCO, CA 94105
Assignment: 2
Reel/Frame:
066087/0461Recorded: 01/10/2024Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SANDISK SEMICONDUCTOR (SHANGHAI) CO. LTD.
Exec Dt:
12/19/2023
Assignee:
SANDISK TECHNOLOGIES LLC
5601 GREAT OAKS PKWY.
LEGAL DEP.
SAN JOSE, CALIFORNIA 95119
Correspondent:
WESTERN DIGITAL TECHNOLOGIES
5601 GREAT OAKS PKWY
LEGAL DEP.
SAN JOSE, CA 95119

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