Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/11/2019
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Application #:
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15885129
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Filing Dt:
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01/31/2018
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Publication #:
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Pub Dt:
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08/02/2018
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Inventors:
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MASATAKA WATABE, YASUTOMO SUGA
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Title:
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Electronic Component Package and Method of Housing an Electronic Component
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-19 KYOBASHI 2-CHOME, CHUO-KU |
| TOKYO, JAPAN 104-0031 |
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| JEFF LLOYD |
| PO BOX 142950 |
| GAINESVILLE, FL 32614-2950 |
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