Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/19/2019
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Application #:
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15513371
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Filing Dt:
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03/22/2017
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Publication #:
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Pub Dt:
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08/16/2018
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Inventors:
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Yuta ISHIGE, Etsuji KATAYAMA, Hajime MORI
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Title:
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SEMICONDUCTOR LASER MODULE AND THREE-DIMENSIONAL LAMINATING AND SHAPING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6F NIHONBASHI FIRST BLDG., 2-19, NIHONBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN |
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| LADAS & PARRY LLP |
| 1040 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10018-3738 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-4, OTEMACHI 2-CHOME |
| CHIYODA-KU, TOKYO 100-8322, JAPAN |
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| SCOTT J. LEBSON |
| 1040 AVENUE OF THE AMERICAS |
| NEW YORK, NY 80995 |
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