Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15490809
|
Filing Dt:
|
04/18/2017
|
|
Publication #:
|
|
Pub Dt:
|
08/16/2018
| | | | |
|
Inventors:
|
CHI-CHENG HUNG, PENG-JU HUANG
|
|
Title:
|
Dual-Chip Package Structure Mounted on a Printed Circuit Board Having a Grounding Heat-Dissipating Pad
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2F., NO.17, GONGYE E. 2ND RD., EAST DIST., |
| HSINCHU CITY, TAIWAN 300 |
|
|
|
|
| LANWAY IPR SERVICES |
| P.O. BOX 230970 |
| CENTREVILLE, VA 20120 |
|
|
Search Results as of:
05/21/2024 04:30 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
