Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15765184
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Filing Dt:
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03/30/2018
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Publication #:
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Pub Dt:
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08/23/2018
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Inventors:
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NAOYA OKAMOTO, TAIGA MATSUSHITA, KAORI MATSUSHITA
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Title:
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FLIP-CHIP PACKAGE WITH PROTECTIVE LAYER FOR ELECTROMAGNETIC NOISE REDUCTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23-23, HONCHO, ITABASHI-KU |
TOKYO, JAPAN 1730001 |
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JEFF LLOYD |
PO BOX 142950 |
GAINESVILLE, FL 32614-2950 |
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05/08/2024 06:38 PM
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