Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/30/2018
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Application #:
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15973522
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Filing Dt:
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05/07/2018
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Publication #:
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Pub Dt:
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09/06/2018
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Inventors:
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Shih-Ping HSU, Che-Wei HSU, Pao-Hung CHOU
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Title:
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MANUFACTURING METHOD OF PACKAGE SUBSTRATE WITH METAL ON CONDUCTIVE PORTIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.458-17, XINXING RD., HUKOU TOWNSHIP |
HSINCHU COUNTY, TAIWAN 30353 |
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CKC & PARTNERS CO., LTD. |
ROOM 1901, 19/F, LEE GARDEN ONE |
33 HYSAN AVENUE, CAUSEWAY BAY |
HONG KONG, HONG KONG |
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