Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/19/2021
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Application #:
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15918261
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Filing Dt:
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03/12/2018
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Publication #:
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Pub Dt:
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09/27/2018
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Inventors:
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Katsuya TAKEMURA, Hiroyuki URANO, Masashi IIO
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Title:
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POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| AARON L. WEBB |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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