Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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15996030
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Filing Dt:
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06/01/2018
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Publication #:
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Pub Dt:
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09/27/2018
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Inventors:
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Yi Pan, Jeffrey A. Zitz, Evan G. Colgan, Hilton T. Toy
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Title:
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Fabricating an Integrated Circuit Chip Module with Stiffening Frame and Orthogonal Heat Spreader
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| ZIP GROUP PLLC - IBM FIS |
| 610 KINGSVIEW LN N |
| MINNEAPOLIS, MN 55447 |
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