Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/16/2021
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Application #:
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15923024
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Filing Dt:
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03/16/2018
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Publication #:
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Pub Dt:
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10/04/2018
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Inventors:
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Yuki Ori, Hideta Arai, Atsushi Miki, Ryo Fukuchi
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Title:
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Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8164 |
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| NIELDS, LEMACK & FRAME, LLC |
| 176 E. MAIN STREET |
| SUITE #5 |
| WESTBOROUGH, MA 01581 |
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