Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/16/2021
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Application #:
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15936600
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Filing Dt:
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03/27/2018
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Publication #:
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Pub Dt:
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10/04/2018
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Inventors:
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Yuki Ori, Hideta Arai, Atsushi Miki, Ryo Fukuchi
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Title:
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Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8164 |
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| NIELDS LEMACK & FRAME LLC |
| 176 E. MAIN STREET |
| SUITE 5 |
| WESTBOROUGH, MA 01581 |
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