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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/01/2019
Application #:
15479810
Filing Dt:
04/05/2017
Publication #:
Pub Dt:
10/11/2018
Inventors:
Timothy Joseph Chainer, Mark Delorman Schultz, Pritish Ranjan Parida
Title:
WAFER LEVEL INTEGRATION FOR EMBEDDED COOLING
Assignment: 1
Reel/Frame:
041861/0229Recorded: 04/05/2017Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/28/2017
Exec Dt:
03/17/2017
Exec Dt:
03/17/2017
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
AMIN, TUROCY & WATSON, LLP
127 PUBLIC SQUARE
57TH FLOOR, KEY TOWER
CLEVELAND, OH 44114
Assignment: 2
Reel/Frame:
045984/0700Recorded: 04/19/2018Pages: 6
Conveyance:
CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/08/2017
Assignee:
2240 B. STREET
BUILDING 11, AREA B
WRIGHT-PATTERSON AFB, OHIO 45433-7109
Correspondent:
KAREN C GULLEY
2240 B. STREET
BUILDING 11, AREA B
WRIGHT-PATTERSON AFB, OH 45433-7109

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