Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/01/2021
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Application #:
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16005348
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Filing Dt:
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06/11/2018
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Publication #:
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Pub Dt:
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10/11/2018
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Inventors:
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Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon et al
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #04-08/09 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| WONG & REES LLP |
| 4340 STEVENS CREEK BLVD., SUITE 106 |
| SAN JOSE, CA 95129 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #04-08/09 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| WONG & REES LLP |
| 4340 STEVENS CREEK BLVD., SUITE 106 |
| SAN JOSE, CA 95129 |
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