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Patent Assignment Abstract of Title
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Total Assignments: 5
Patent #:
10217719
Issue Dt:
02/26/2019
Application #:
15481331
Filing Dt:
04/06/2017
Publication #:
20180294249
Pub Dt:
10/11/2018
Inventors:
Mitsuhisa Watanabe, Fumitomo Watanabe, Masanori Yoshida
Title:
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
Assignment: 1
Reel/Frame:
042181/0111Recorded: 04/06/2017Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WATANABE, MITSUHISA
Exec Dt:
02/28/2017
WATANABE, FUMITOMO
Exec Dt:
02/27/2017
YOSHIDA, MASANORI
Exec Dt:
02/27/2017
Assignee:
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY
P.O. BOX 6
BOISE, IDAHO 83707
Correspondent:
PERKINS COIE LLP
P.O. BOX 1247
PATENT PROCUREMENT
SEATTLE, WA 98111-1247
Assignment: 2
Reel/Frame:
042405/0909Recorded: 05/04/2017Pages: 22
Conveyance:
SUPPLEMENT NO. 4 TO PATENT SECURITY AGREEMENT
Assignor:
MICRON TECHNOLOGY, INC.
Exec Dt:
04/25/2017
Assignee:
MORGAN STANLEY SENIOR FUNDING, INC.
1300 THAMES STREET
4TH FLOOR
BALTIMORE, MARYLAND 21231
Correspondent:
GENEVIEVE DORMENT, ESQ.
SIMPSON THACHER & BARTLETT LLP
425 LEXINGTON AVENUE
NEW YORK, NY 10017
Assignment: 3
Reel/Frame:
047540/0001Recorded: 07/13/2018Pages: 843
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MICRON TECHNOLOGY, INC.
Exec Dt:
07/03/2018
MICRON SEMICONDUCTOR PRODUCTS, INC.
Exec Dt:
07/03/2018
Assignee:
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
10 S. DEARBORN
7TH FLOOR
CHICAGO, ILLINOIS 60603
Correspondent:
MARCELA ROBLEDO
2475 HANOVER STREET
PALO ALTO, CA 94304
Assignment: 4
Reel/Frame:
050702/0451Recorded: 10/09/2019Pages: 24
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Exec Dt:
07/31/2019
Assignee:
MICRON TECHNOLOGY, INC.
8000 S FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
WSGR, C/O QUI LU FLOOD, SENIOR PARALEGAL
ONE MARKET, SPEAR TOWER, SUITE 3300
SAN FRANCISCO, CA 94105
Assignment: 5
Reel/Frame:
051028/0001Recorded: 11/12/2019Pages: 834
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Exec Dt:
07/31/2019
Assignees:
MICRON TECHNOLOGY, INC.
8000 S FEDERAL WAY
BOISE, IDAHO 83707
MICRON SEMICONDUCTOR PRODUCTS, INC.
8000 S FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
WSGR, C/O QUI LU FLOOD, SENIOR PARALEGAL
ONE MARKET, SPEAR TOWER, SUITE 3300
SAN FRANCISCO, CA 94105

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