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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
15767630
Filing Dt:
04/11/2018
Publication #:
20180294302
Pub Dt:
10/11/2018
Inventors:
Zhiqi Wang, Zhijie Shen, Jiawei Chen
Title:
IMAGE SENSING CHIP PACKAGING STRUCTURE AND METHOD
Assignment: 1
Reel/Frame:
045511/0590Recorded: 04/11/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, ZHIQI
Exec Dt:
03/23/2018
SHEN, ZHIJIE
Exec Dt:
03/23/2018
CHEN, JIAWEI
Exec Dt:
03/23/2018
Assignee:
CHINA WAFER LEVEL CSP CO., LTD.
NO. 29 TINGLAN LANE SIP. SUZHOU
JIANGSU, CHINA 215026
Correspondent:
JAMES H. MORRIS
WOLF, GREENFIELD & SACKS, P.C.
600 ATLANTIC AVENUE
BOSTON, MA 02210
Assignment: 2
Reel/Frame:
057434/0319Recorded: 05/12/2021Pages: 5
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER 15/767360 PREVIOUSLY RECORDED AT REEL: 045511 FRAME: 0590. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
WANG, ZHIQI
Exec Dt:
03/23/2018
SHEN, ZHIJIE
Exec Dt:
03/23/2018
CHEN, JIAWEI
Exec Dt:
03/23/2018
Assignee:
CHINA WAFER LEVEL CSP CO., LTD.
NO. 29 TINGLAN LANE SIP. SUZHOU
JIANGSU, CHINA 215026
Correspondent:
JAMES H. MORRIS
WOLF GREENFIELD & SACKS P.C.
600 ATLANTICE AVENUE
BOSTON, MA 02210

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