Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16016228
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Filing Dt:
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06/22/2018
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Publication #:
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Pub Dt:
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10/18/2018
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Inventors:
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Shusuke Yoshihara, Takashi Ando
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Title:
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RESIN COMPOSITION, SEMI-CURED THERMALLY CONDUCTIVE FILM USING SAME, CIRCUIT BOARD AND ADHESIVE SHEET
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3-18, NAKANOSHIMA, KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 5308288 |
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| JEFFEREY S. BERGMAN |
| 909 FANNIN ST |
| SUITE 3500 |
| HOUSTON, TX 77010 |
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