Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/16/2020
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Application #:
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15486306
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Filing Dt:
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04/13/2017
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Publication #:
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Pub Dt:
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10/18/2018
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Inventors:
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Zi-Jheng Liu, Hung-Jui Kuo, Yu-Hsiang Hu
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30078 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, 100 TAIWAN |
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