Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/21/2020
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Application #:
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15769705
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Filing Dt:
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04/19/2018
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Publication #:
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Pub Dt:
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10/25/2018
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PCT #:
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US2015063046
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Inventors:
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Chandra JHA, Eric LI
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Title:
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STACKED DIE PACKAGE WITH THROUGH-MOLD THERMALLY CONDUCTIVE STRUCTURES BETWEEN A BOTTOM DIE AND A THERMALLY CONDUCTIVE MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1211 SW 5TH AVENUE, STE. 1600 |
| PORTLAND, OR 97204 |
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