Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/01/2022
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Application #:
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15769728
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Filing Dt:
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04/19/2018
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Publication #:
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Pub Dt:
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11/01/2018
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Inventors:
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Miki SAWAI, Daisuke ITO, Ryo SHIMIZU, Hirotaka SAZUKA
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Title:
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WORKPIECE CONVEYANCE APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS, AND WORKPIECE CONVEYANCE METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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11-1, OSAKI 1-CHOME |
SHINAGAWA-KU, TOKYO, JAPAN 1410032 |
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HOLTZ, HOLTZ, & VOLEK PC |
630 NINTH AVENUE, SUITE 1010 |
NEW YORK, NY 10036-3744 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-1, FUKUURA 2-CHOME |
KANAZAWA-KU |
YOKOHAMA-SHI, KANAGAWA, JAPAN 236-0004 |
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HOLTZ, HOLTZ & VOLEK PC |
630 NINTH AVENUE |
SUITE 1010 |
NEW YORK, NY 10036 |
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04/29/2024 08:21 AM
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