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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/21/2019
Application #:
15769589
Filing Dt:
04/19/2018
Publication #:
Pub Dt:
11/01/2018
Inventors:
Qing GONG, Yaxuan SUN, Shuming ZHAO, Jingjing LUO, Xinping LIN, Bo WU, Donghai CHENG
Title:
BASE PLATE FOR HEAT SINK AS WELL AS HEAT SINK AND IGBT MODULE HAVING THE SAME
Assignment: 1
Reel/Frame:
046813/0439Recorded: 09/07/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/10/2018
Exec Dt:
04/10/2018
Exec Dt:
04/10/2018
Exec Dt:
04/10/2018
Exec Dt:
04/10/2018
Exec Dt:
04/10/2018
Exec Dt:
04/10/2018
Assignee:
3009, BYD ROAD
PINGSHAN, SHENZHEN
GUANGDONG, CHINA 518118
Correspondent:
YIZHOU LIU
CALFEE, HALTER & GRISWOLD LLP
1405 EAST SIXTH STREET
CLEVELAND, OH 44114-1607

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