Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/23/2021
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Application #:
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15982568
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Filing Dt:
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05/17/2018
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Publication #:
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Pub Dt:
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11/08/2018
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Inventors:
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Jie BAI, Ly DO
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Title:
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RESIN COMPOSITIONS FOR UNDERFILL FILM FOR THREE DIMENSIONAL THROUGH SILICA VIA (TSV) PACKAGES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HENKELSTRASSE 67 |
| DUESSELDORF, GERMANY 40589 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HENKELSTRASSE 67 |
| DUESSELDORF, GERMANY 40589 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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