Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/02/2021
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Application #:
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15943736
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Filing Dt:
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04/03/2018
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Publication #:
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Pub Dt:
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11/08/2018
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Inventors:
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Yi-Hung Lin, Chien-Chang Lu, Cheng-I Wu, Li-Wei Sung, Cheng-Chi Wang, Chin-Lung Ting
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Title:
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PACKAGE STRUCTURE WITH TFTS AND DIE COVERED RDL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 160 KESYUE RD., JHU-NAN SITE, HSINCHU SCIENCE PARK, JHU-NAN |
MIAO-LI COUNTY, TAIWAN |
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WINSTON HSU |
5F., NO.389, FUHE RD., YONGHE DIST., |
NEW TAIPEI CITY, TAIWAN |
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