Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/22/2020
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Application #:
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15772483
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Filing Dt:
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04/30/2018
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Publication #:
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Pub Dt:
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11/15/2018
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Inventors:
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Mao GUO, John G. MEYERS, Yong SHE, Bin LIU, Lingyan L. TAN
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Title:
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PRE-MOLDED ACTIVE IC OF PASSIVE COMPONENTS TO MINIATURIZE SYSTEM IN PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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JUSTIN K. BRASK |
1211 SW 5TH AVENUE, STE. 1600 |
PORTLAND, OR 97204 |
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05/21/2024 04:36 AM
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