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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/19/2019
Application #:
15597187
Filing Dt:
05/17/2017
Publication #:
Pub Dt:
11/22/2018
Inventors:
Brian Pepin, Shiv Sabesan, Bo Lu
Title:
THIN-FILM ELECTRODE ASSEMBLY WITH SOFT OVERMOLD
Assignment: 1
Reel/Frame:
042404/0047Recorded: 05/17/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/16/2017
Exec Dt:
05/16/2017
Exec Dt:
05/16/2017
Assignee:
1600 AMPHITHEATRE PARKWAY
MOUNTAIN VIEW, CALIFORNIA 94043
Correspondent:
KILPATRICK TOWNSEND & STOCKTON LLP/VERIL
MAILSTOP: IP DOCKETING - 22
1100 PEACHTREE STREET, SUITE 2800
ATLANTA, GA 30309

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