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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10370814
Issue Dt:
08/06/2019
Application #:
15713393
Filing Dt:
09/22/2017
Publication #:
20180340309
Pub Dt:
11/29/2018
Inventors:
HONGTAO FU, JUN WANG, YUANQIANG CAI, HUANHUAN QIAO, YAWEI JIN, PENG WANG, JUNFENG NI et al
Title:
SYSTEM FOR CONSOLIDATING SOFT CLAY BY COMBINED ANODE BOOSTING AND ELECTRO-OSMOSIS AND METHOD FOR CONSOLIDATING SOFT CLAY
Assignment: 1
Reel/Frame:
043978/0292Recorded: 09/22/2017Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FU, HONGTAO
Exec Dt:
07/21/2017
WANG, JUN
Exec Dt:
07/21/2017
CAI, YUANQIANG
Exec Dt:
07/21/2017
QIAO, HUANHUAN
Exec Dt:
07/21/2017
JIN, YAWEI
Exec Dt:
07/21/2017
WANG, PENG
Exec Dt:
07/21/2017
NI, JUNFENG
Exec Dt:
07/21/2017
FANG, ZIQUAN
Exec Dt:
07/21/2017
JIN, JINQIANG
Exec Dt:
07/21/2017
LV, YOUCHANG
Exec Dt:
07/21/2017
JIN, HAISHENG
Exec Dt:
07/21/2017
ZHOU, CHANGCHEN
Exec Dt:
07/21/2017
Assignee:
WENZHOU UNIVERSITY
UNIVERSITY SCIENCE PARK OF WENZHOU CITY, NO.38 DONGFANG RD.,OUHAI ECONOMIC DEVELOPMENT ZONE,
WENZHOU, ZHEJIANG PROVINCE, CHINA 325200
Correspondent:
JACOBSON HOLMAN PLLC
400 SEVENTH STREET N.W. SUITE 700
WASHINGTON, DC 20004-2218

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