Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15757937
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Filing Dt:
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03/06/2018
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Publication #:
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Pub Dt:
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12/06/2018
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Inventors:
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Hidetsugu SAWADA, Shiori TAKAISHI, Tatsuo KANOU
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Title:
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MOLDING MATERIAL FOR THERMOCOMPRESSION MOLDING, MOLDED ARTICLE PRODUCED BY USING THE SAME, AND METHOD FOR PRODUCING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 35-58, SAKASHITA 3-CHOME, ITABASHI-KU |
| TOKYO, JAPAN 174-8520 |
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| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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