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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10290584
Issue Dt:
05/14/2019
Application #:
15725642
Filing Dt:
10/05/2017
Publication #:
20180350745
Pub Dt:
12/06/2018
Inventors:
Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu et al
Title:
CONDUCTIVE VIAS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
Assignment: 1
Reel/Frame:
045519/0215Recorded: 04/12/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HSIEH, CHENG-HSIEN
Exec Dt:
09/05/2017
HSU, LI-HAN
Exec Dt:
09/05/2017
WU, WEI-CHENG
Exec Dt:
09/05/2017
CHEN, HSIEN-WEI
Exec Dt:
09/05/2017
YEH, DER-CHYANG
Exec Dt:
03/12/2018
WU, CHI-HSI
Exec Dt:
03/12/2018
YU, CHEN-HUA
Exec Dt:
03/19/2018
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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