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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/07/2020
Application #:
15617774
Filing Dt:
06/08/2017
Publication #:
Pub Dt:
12/13/2018
Inventors:
Henley Liu, Gamal Refai-Ahmed, Ferdinand F. Fernandez, Suresh Ramalingam et al
Title:
METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LINE THICKNESS (BLT) REDUCTION AND TIM ADHESION ENHANCEMENT FOR EFFICIENT THERMAL MANAGEMENT
Assignment: 1
Reel/Frame:
042654/0205Recorded: 06/08/2017Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/08/2017
Exec Dt:
06/08/2017
Exec Dt:
06/08/2017
Exec Dt:
06/08/2017
Exec Dt:
06/08/2017
Exec Dt:
06/08/2017
Exec Dt:
06/08/2017
Exec Dt:
06/08/2017
Assignee:
2100 LOGIC DRIVE
SAN JOSE, CALIFORNIA 95124
Correspondent:
XILINX, INC.
2100 LOGIC DR
ATTN: LEGAL DEPT
SAN JOSE, CA 95124

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