Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15620968
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Filing Dt:
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06/13/2017
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Publication #:
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Pub Dt:
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12/13/2018
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Inventors:
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David M. Audette, Sukjay Chey, Dennis R. Conti, Marc D. Knox, Sankeerth Rajalingam et al
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Title:
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PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORP. - FISHKILL DRAFTING CENTER |
| 2455 SOUTH ROAD |
| M/S P386, BLDG. 008-2 |
| POUGHKEEPSIE, NY 12601 |
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