Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15625089
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Filing Dt:
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06/16/2017
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Publication #:
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Pub Dt:
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12/20/2018
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Inventors:
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Yaoling PAN, John HONG, Jian MA, Tallis CHANG
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Title:
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WAFER LEVEL INTEGRATED OPTICS IN PACKAGING FOR IMAGING SENSOR APPLICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4250 EXECUTIVE SQUARE, 2ND FLOOR |
| SAN DIEGO, CALIFORNIA 92037 |
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| DESMOND P. O'SULLIVAN |
| MORRISON & FOERSTER LLP |
| 12531 HIGH BLUFF DRIVE, SUITE 100 |
| SAN DIEGO, CA 92130-2040 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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| DESMOND P. O'SULLIVAN |
| MORRISON & FOERSTER LLP |
| 12531 HIGH BLUFF DRIVE, SUITE 100 |
| SAN DIEGO, CA 92130-2040 |
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