Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2019
|
Application #:
|
16060715
|
Filing Dt:
|
06/08/2018
|
|
Publication #:
|
|
Pub Dt:
|
12/20/2018
| | | | |
|
Inventors:
|
Shintaro IIDA, Reiko IZUMI, Ken HAYASHII, Hideaki SAKURAI, Keiko ASHIDA
|
|
Title:
|
HEAT-RESISTANT INSULATED WIRE AND ELECTRODEPOSITION LIQUID USED TO FORM INSULATING LAYER THEREFOR
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 3-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
|
|
|
|
| MITSUHIRO HARAGUCHI, LEASON ELLIS LLP |
| ONE BARKER AVENUE |
| FIFTH FLOOR |
| WHITE PLAINS, NY 10601-1526 |
|
|
Search Results as of:
05/09/2024 06:39 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
