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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10304800
Issue Dt:
05/28/2019
Application #:
15800962
Filing Dt:
11/01/2017
Publication #:
20180374821
Pub Dt:
12/27/2018
Inventors:
WEIMING CHRIS CHEN, TING-YU YEH, CHIA-HSIN CHEN, TU-HAO YU, KUO-CHIANG TING et al
Title:
PACKAGING WITH SUBSRTATES CONNECTED BY CONDUCTIVE BUMPS
Assignment: 1
Reel/Frame:
044239/0879Recorded: 11/28/2017Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHEN, WEIMING CHRIS
Exec Dt:
10/30/2017
YEH, TING-YU
Exec Dt:
10/27/2017
CHEN, CHIA-HSIN
Exec Dt:
10/30/2017
YU, TU-HAO
Exec Dt:
10/27/2017
TING, KUO-CHIANG
Exec Dt:
10/30/2017
HOU, SHANG-YUN
Exec Dt:
10/30/2017
WU, CHI-HSI
Exec Dt:
11/06/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
WPAT, P.C. LAW GROUP, INTELLECTUAL PROPERTY ATTORN
2301 DUPONT DRIVE, SUITE 510
IRVINE, CA 92612

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