Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/29/2020
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Application #:
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15861421
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Filing Dt:
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01/03/2018
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Publication #:
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Pub Dt:
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12/27/2018
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Inventors:
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Shaw Fong Wong, Wei Keat Loh, Kang Eu Ong, AU Seong Wong
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Title:
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LOWER IC PACKAGE STRUCTURE FOR COUPLING WITH AN UPPER IC PACKAGE TO FORM A PACKAGE-ON-PACKAGE (PoP) ASSEMBLY AND PoP ASSEMBLY INCLUDING SUCH A LOWER IC PACKAGE STRUCTURE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BLANCHARDSTOWN CORPORATE PARK 2 |
PLAZA 255, SUITE 2A |
DUBLIN, IRELAND D15 YH6H |
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TAHOE RESEARCH, LTD. |
BLANCHARDSTOWN CORPORATE PARK 2 |
PLAZA 255, SUITE 2A |
DUBLIN, D15 YH6H IRELAND |
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