Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15957955
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Filing Dt:
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04/20/2018
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Publication #:
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Pub Dt:
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01/03/2019
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Inventor:
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Lianjie QU
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Title:
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METHOD FOR PACKAGING CHIP AND CHIP PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 10 JIUXIANQIAO RD. |
| CHAOYANG DISTRICT |
| BEIJING, CHINA 100015 |
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| NO. 118 JINGHAIYILU, BDA |
| BEIJING, CHINA 100176 |
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| TODD R. TUCKER |
| CALFEE, HALTER & GRISWOLD LLP |
| THE CALFEE BUILDING, 1405 EAST SIXTH ST. |
| CLEVELAND, OH 44114 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT APPLICATION NUMBER 15954955 PREVIOUSLY RECORDED ON REEL 046089 FRAME 0148. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| NO. 10 JIUXIANQIAO RD. |
| CHAOYANG DISTRICT |
| BEIJING, CHINA 100015 |
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| NO. 118 JINGHAIYILU, BDA |
| BEIJING, CHINA 100176 |
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| TODD R. TUCKER |
| CALFEE, HALTER & GRISWOLD LLP |
| THE CALFEE BUILDING, 1405 EAST SIXTH ST. |
| CLEVELAND, OH 44114 |
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