Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2020
|
Application #:
|
15573584
|
Filing Dt:
|
11/13/2017
|
|
Publication #:
|
|
Pub Dt:
|
01/03/2019
| | | | |
|
Inventors:
|
Vittorio CUOCO, Youri VOLKHINE, Yi ZHU, Josephus VAN DER ZANDEN, Anna WALESIENIUK
|
|
Title:
|
GUARD BOND WIRES IN AN INTEGRATED CIRCUIT PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| HALFGELEIDERWEG 8 |
| AV NIJMEGEN, NETHERLANDS 6534 |
|
|
|
|
| MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
| 300 SOUTH WACKER DRIVE |
| SUITE #3100 |
| CHICAGO, IL 60606 |
|
|
Search Results as of:
05/14/2024 07:47 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
