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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
15748888
Filing Dt:
01/30/2018
Publication #:
Pub Dt:
01/10/2019
Inventors:
Chien-Hua Chen, Michael W. Cumbie
Title:
PRINTHEAD WITH NON-EPOXY MOLD COMPOUND
Assignment: 1
Reel/Frame:
044814/0237Recorded: 02/02/2018Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/13/2015
Exec Dt:
10/13/2015
Assignee:
11445 COMPAQ CENTER DRIVE WEST
HOUSTON, TEXAS 77070
Correspondent:
HP INC.
3390 E. HARMONY ROAD MS 35
INTELLECTUAL PROPERTY
FORT COLLINS, CO 80528

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